XC3S400-4FTG256C vs XC3S400-4FT256I Comparison
Detailed side-by-side comparison of XC3S400-4FTG256C by AMD and XC3S400-4FT256I by Xilinx. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC3S400-4FTG256C | XC3S400-4FT256I |
|---|---|---|
| Brand | AMD | Xilinx |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Unknown | Last Time Buy |
| Device Type | Spartan-3 Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| System Gates | 294,912 gates | 400,000 gates |
| Logic Cells | 8,064 cells | 8,064 logic cells |
| Architecture | Spartan-3 | — |
| Core Supply Voltage | 1.2 V | 1.14 V to 1.26 V |
| Package Type | 256-LBGA | Lead-free FTBGA |
| Package Designation | FTG256 | — |
| Device Number | 173 | — |
| Lead-Free Construction | Lead-free | — |
| Operating Temperature | 0 °C to +85 °C | 0 °C to 85 °C |
| Mounting Type | Surface Mount | Surface mount |
| I/O Count | 264 I/O | — |
| Block RAM | [DATA_NEEDED: Block RAM capacity] | — |
| Maximum Clock Frequency | [DATA_NEEDED: Maximum clock frequency] | — |
| Configuration Memory | [DATA_NEEDED: Configuration memory] | — |
| Digital I/O Standards | [DATA_NEEDED: Digital I/O standards] | — |
| RoHS Status | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | [DATA_NEEDED: REACH status] |
| FPGA Family | — | Spartan-3 |
| User I/O | — | 173 I/Os |
| Package | — | 256-ball FTBGA |
| Number of Pins | — | 256 pins |
| Process Technology | — | 90 nm |
| Nominal Core Voltage | — | 1.2 V |
| Performance Grade | — | -4 speed grade |
| Maximum Performance | — | 630 MHz |
| Temperature Grade | — | Industrial |
| Logic Resource Count | — | 192 logic blocks |
| Lead-Free Status | — | Lead free |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Pinout | — | [DATA_NEEDED: complete manufacturer pinout] |