XC3S400-4FTG256C vs XC3S400A-4FTG256C Comparison

Detailed side-by-side comparison of XC3S400-4FTG256C by AMD and XC3S400A-4FTG256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC3S400-4FTG256C XC3S400A-4FTG256C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Active
Device Type Spartan-3 Field Programmable Gate Array (FPGA) —
System Gates 294,912 gates 400,000
Logic Cells 8,064 cells 8,064
Architecture Spartan-3 —
Core Supply Voltage 1.2 V —
Package Type 256-LBGA —
Package Designation FTG256 —
Device Number 173 —
Lead-Free Construction Lead-free —
Operating Temperature 0 °C to +85 °C 0°C to +85°C (commercial)
Mounting Type Surface Mount Surface Mount (BGA)
I/O Count 264 I/O —
Block RAM [DATA_NEEDED: Block RAM capacity] —
Maximum Clock Frequency [DATA_NEEDED: Maximum clock frequency] —
Configuration Memory [DATA_NEEDED: Configuration memory] —
Digital I/O Standards [DATA_NEEDED: Digital I/O standards] —
RoHS Status unknown —
REACH Status unknown —
Family — Spartan-3A
Manufacturer — AMD (Xilinx)
Block RAM Bits — 368,640
Block RAM Blocks — 20 (18 Kbit each)
User I/Os — 195
Dedicated Multipliers — 4 (18 × 18-bit signed)
Digital Clock Managers (DCMs) — 4
Speed/Grade — -4 (commercial)
Max Internal Clock — 770 MHz
Process — 90 nm CMOS
Package — 256-FTBGA (FTG256), 17 × 17 mm
Configuration Modes — SPI, BPI, JTAG

Datasheets & Resources

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