XC3S4000-4FG900C vs XC3S4000-4FG900I Comparison
Detailed side-by-side comparison of XC3S4000-4FG900C by AMD and XC3S4000-4FG900I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC3S4000-4FG900C | XC3S4000-4FG900I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-3 Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3 | — |
| System Gates | 4,000,000 gates | 4,000,000 gates |
| Logic Cells | 62,208 cells | — |
| Configurable Logic Blocks | 6,912 CLBs | — |
| Logic Array Blocks | 6,912 LABs | 6,912 LABs |
| Total RAM Bits | 1,769,472 bits | — |
| User I/O | 633 I/O | 633 I/O |
| Core Supply Voltage Range | 1.14 V to 1.26 V | — |
| Nominal Core Supply Voltage | 1.2 V | — |
| Operating Temperature Range | 0 °C to 85 °C | [DATA_NEEDED: operating temperature range] |
| Package Type | 900-FBGA | — |
| Package Ball Count | 900 balls | — |
| Mounting Type | SMD | Surface-mount ball grid array |
| Speed Grade | -4 | -4 |
| Temperature Grade | Commercial | Industrial |
| Lead-Free Status | Lead Free | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Logic Elements | — | 62,208 logic elements |
| Core Supply Voltage | — | 1.2 V |
| Process Technology | — | 90 nm |
| Performance | — | 630 MHz |
| Package | — | 900-BBGA |
| Adaptive Logic Modules | — | 27,648 ALMs |
| Embedded Memory | — | 1.69 Mbit |
| Programming Interface | — | [DATA_NEEDED: programming interface] |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Automotive Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |