XC3S4000-4FG900C vs XC3S4000-5FG900C Comparison
Detailed side-by-side comparison of XC3S4000-4FG900C by AMD and XC3S4000-5FG900C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC3S4000-4FG900C | XC3S4000-5FG900C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Device Type | Field Programmable Gate Array (FPGA) | FPGA |
| FPGA Family | Spartan-3 | Spartan-3 |
| System Gates | 4,000,000 gates | 4,000,000 gates |
| Logic Cells | 62,208 cells | 62,208 cells |
| Configurable Logic Blocks | 6,912 CLBs | — |
| Logic Array Blocks | 6,912 LABs | — |
| Total RAM Bits | 1,769,472 bits | — |
| User I/O | 633 I/O | 633 I/O |
| Core Supply Voltage Range | 1.14 V to 1.26 V | — |
| Nominal Core Supply Voltage | 1.2 V | — |
| Operating Temperature Range | 0 °C to 85 °C | — |
| Package Type | 900-FBGA | — |
| Package Ball Count | 900 balls | — |
| Mounting Type | SMD | Surface Mount |
| Speed Grade | -4 | 5 |
| Temperature Grade | Commercial | Commercial |
| Lead-Free Status | Lead Free | Lead free |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Maximum Device Performance | — | 725 MHz |
| Core Supply Voltage | — | 1.2 V |
| Process Technology | — | 90 nm CMOS |
| Package | — | 900-pin FBGA |
| Package Pin Count | — | 900 pins |
| Operating Temperature | — | 0 °C to 85 °C |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| Dedicated Multiplier Count | — | [DATA_NEEDED: dedicated multiplier count] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |