XC3S4000-4FG900I vs XC3S4000-4FG900C Comparison
Detailed side-by-side comparison of XC3S4000-4FG900I by AMD and XC3S4000-4FG900C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC3S4000-4FG900I | XC3S4000-4FG900C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Device Type | Spartan-3 Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| System Gates | 4,000,000 gates | 4,000,000 gates |
| Logic Elements | 62,208 logic elements | — |
| User I/O | 633 I/O | 633 I/O |
| Speed Grade | -4 | -4 |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 90 nm | — |
| Performance | 630 MHz | — |
| Package | 900-BBGA | — |
| Temperature Grade | Industrial | Commercial |
| Logic Array Blocks | 6,912 LABs | 6,912 LABs |
| Adaptive Logic Modules | 27,648 ALMs | — |
| Embedded Memory | 1.69 Mbit | — |
| Mounting Type | Surface-mount ball grid array | SMD |
| Programming Interface | [DATA_NEEDED: programming interface] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | 0 °C to 85 °C |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Automotive Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| FPGA Family | — | Spartan-3 |
| Logic Cells | — | 62,208 cells |
| Configurable Logic Blocks | — | 6,912 CLBs |
| Total RAM Bits | — | 1,769,472 bits |
| Core Supply Voltage Range | — | 1.14 V to 1.26 V |
| Nominal Core Supply Voltage | — | 1.2 V |
| Package Type | — | 900-FBGA |
| Package Ball Count | — | 900 balls |
| Lead-Free Status | — | Lead Free |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |