XC3S4000-5FG900C vs XC3S4000-4FG900C Comparison
Detailed side-by-side comparison of XC3S4000-5FG900C by AMD and XC3S4000-4FG900C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC3S4000-5FG900C | XC3S4000-4FG900C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Obsolete |
| Device Type | FPGA | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3 | Spartan-3 |
| System Gates | 4,000,000 gates | 4,000,000 gates |
| Logic Cells | 62,208 cells | 62,208 cells |
| Maximum Device Performance | 725 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 90 nm CMOS | — |
| User I/O | 633 I/O | 633 I/O |
| Package | 900-pin FBGA | — |
| Package Pin Count | 900 pins | — |
| Speed Grade | 5 | -4 |
| Temperature Grade | Commercial | Commercial |
| Operating Temperature | 0 °C to 85 °C | — |
| Mounting Type | Surface Mount | SMD |
| Lead-Free Status | Lead free | Lead Free |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| Dedicated Multiplier Count | [DATA_NEEDED: dedicated multiplier count] | — |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Configurable Logic Blocks | — | 6,912 CLBs |
| Logic Array Blocks | — | 6,912 LABs |
| Total RAM Bits | — | 1,769,472 bits |
| Core Supply Voltage Range | — | 1.14 V to 1.26 V |
| Nominal Core Supply Voltage | — | 1.2 V |
| Operating Temperature Range | — | 0 °C to 85 °C |
| Package Type | — | 900-FBGA |
| Package Ball Count | — | 900 balls |
| Package Dimensions | — | [DATA_NEEDED: package dimensions] |