XC3S50A-4FTG256C vs EP2C5AF256I8N Comparison
Detailed side-by-side comparison of XC3S50A-4FTG256C by AMD and EP2C5AF256I8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC3S50A-4FTG256C | EP2C5AF256I8N |
|---|---|---|
| Brand | AMD | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Device Type | Spartan-3A field-programmable gate array | — |
| Logic Gates | 50K gates | — |
| Logic Cells | 55,296 cells | — |
| Configurable Slices | 1,584 slices | — |
| User I/O | 144 I/O | — |
| Maximum Performance | 667 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | -4 | 8 |
| Temperature Grade | Commercial (C) | — |
| Package | 256-ball FTBGA | 256-LBGA (FBGA), 17 mm body |
| Total Terminals | 256 terminals | — |
| Package Type | BGA | — |
| Package Shape | Square | — |
| Logic Technology | Configurable digital logic and interconnect | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| IO Standard | [DATA_NEEDED: supported I/O standards] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (lead-free, 'N' suffix) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Automotive Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Family | — | Cyclone II |
| Logic Elements | — | 4,608 |
| Total RAM Bits | — | 119,808 |
| Number of I/O Pins | — | 158 |
| Number of Logic Units / LABs | — | [DATA_NEEDED: number of LABs] |
| Embedded Multipliers (18x18) | — | 13 |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Maximum Toggle Frequency | — | 402.5 MHz |
| Mounting Type | — | Surface Mount (BGA) |
| Operating Temperature | — | -40 °C to +85 °C (Industrial) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| DSP Performance | — | Up to approximately 25 GMACS |