XC3S50A-4FTG256C vs XC3S400A-4FTG256C Comparison
Detailed side-by-side comparison of XC3S50A-4FTG256C by AMD and XC3S400A-4FTG256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC3S50A-4FTG256C | XC3S400A-4FTG256C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Device Type | Spartan-3A field-programmable gate array | — |
| Logic Gates | 50K gates | — |
| Logic Cells | 55,296 cells | 8,064 |
| Configurable Slices | 1,584 slices | — |
| User I/O | 144 I/O | — |
| Maximum Performance | 667 MHz | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | -4 | — |
| Temperature Grade | Commercial (C) | — |
| Package | 256-ball FTBGA | 256-FTBGA (FTG256), 17 × 17 mm |
| Total Terminals | 256 terminals | — |
| Package Type | BGA | — |
| Package Shape | Square | — |
| Logic Technology | Configurable digital logic and interconnect | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| IO Standard | [DATA_NEEDED: supported I/O standards] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Automotive Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Family | — | Spartan-3A |
| Manufacturer | — | AMD (Xilinx) |
| System Gates | — | 400,000 |
| Block RAM Bits | — | 368,640 |
| Block RAM Blocks | — | 20 (18 Kbit each) |
| User I/Os | — | 195 |
| Dedicated Multipliers | — | 4 (18 × 18-bit signed) |
| Digital Clock Managers (DCMs) | — | 4 |
| Speed/Grade | — | -4 (commercial) |
| Max Internal Clock | — | 770 MHz |
| Operating Temperature | — | 0°C to +85°C (commercial) |
| Process | — | 90 nm CMOS |
| Configuration Modes | — | SPI, BPI, JTAG |
| Mounting Type | — | Surface Mount (BGA) |