XC5VLX30-1FF676C vs XC5VLX30-1FF676I Comparison

Detailed side-by-side comparison of XC5VLX30-1FF676C by Xilinx and XC5VLX30-1FF676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC5VLX30-1FF676C XC5VLX30-1FF676I
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Device Type Virtex-5 LX Field Programmable Gate Array (FPGA) Virtex-5 LX field-programmable gate array (FPGA)
Logic Cells 30,720 30,720 cells
Number of Gates 1,179,648 —
User I/O 400 —
Package 676-BBGA (FCBGA), 676 balls —
Number of Terminals 676 —
Terminal Form Ball (BGA) Ball
Package Shape Square Square
Architecture ASMBL column-based FPGA, 2nd generation —
Speed Grade -1 -1
Temperature Grade Commercial Industrial
Configuration Memory SRAM-based, volatile (bitstream reload required at power-up) —
RoHS Status RoHS Non-Compliant [DATA_NEEDED: RoHS status]
Lead Free Status Contains Lead —
Manufacturer AMD / Xilinx —
DSP48E Slices [DATA_NEEDED: DSP48E slice count] —
Block RAM [DATA_NEEDED: block RAM quantity] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Supply Voltage Range [DATA_NEEDED: core and I/O supply voltages] —
Operating Temperature Range [DATA_NEEDED: commercial junction/ambient temperature range] —
Configurable Logic Blocks — 2,400 CLBs
Input/Output Count — 400 I/O
Listed Maximum Frequency — 1098 MHz
Supply Voltage — 1 V
Package Type — 676-ball FCBGA
Package Code — FF676
Package Dimensions — 27 mm x 27 mm
Device Technology — CMOS
Mounting Type — Surface mount
Lead-Free Status — Lead free
REACH Status — REACH 211 certified
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

Datasheets & Resources

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