XC5VLX30-1FF676C vs XC5VLX30-2FF676C Comparison

Detailed side-by-side comparison of XC5VLX30-1FF676C by Xilinx and XC5VLX30-2FF676C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC5VLX30-1FF676C XC5VLX30-2FF676C
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Device Type Virtex-5 LX Field Programmable Gate Array (FPGA) Virtex-5 LX field-programmable gate array
Logic Cells 30,720 30,720 cells
Number of Gates 1,179,648 —
User I/O 400 —
Package 676-BBGA (FCBGA), 676 balls 676-BBGA FCBGA
Number of Terminals 676 676 terminals
Terminal Form Ball (BGA) —
Package Shape Square —
Architecture ASMBL column-based FPGA, 2nd generation —
Speed Grade -1 -2
Temperature Grade Commercial —
Configuration Memory SRAM-based, volatile (bitstream reload required at power-up) —
RoHS Status RoHS Non-Compliant RoHS non-compliant
Lead Free Status Contains Lead —
Manufacturer AMD / Xilinx —
DSP48E Slices [DATA_NEEDED: DSP48E slice count] —
Block RAM [DATA_NEEDED: block RAM quantity] [DATA_NEEDED: block RAM capacity]
I/O Standards [DATA_NEEDED: supported I/O standards] —
Supply Voltage Range [DATA_NEEDED: core and I/O supply voltages] —
Operating Temperature Range [DATA_NEEDED: commercial junction/ambient temperature range] —
Number of I/O — 400 I/O
Package Type — BGA
Process Technology — 65 nm CMOS
Supply Voltage — 1 V
FPGA Architecture — Second-generation ASMBL column-based architecture
Programmable Logic Blocks — 2,400 CLBs
Maximum Frequency — 1,098 MHz
Package Dimensions — 27 x 27 mm
Mounting Style — Surface mount
Lead-Free Status — Contains lead
Operating Temperature — [DATA_NEEDED: operating temperature range]
DSP Resources — [DATA_NEEDED: DSP resource count]

Datasheets & Resources

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