XC5VLX30-2FF324C vs XC5VLX30-2FF324I Comparison
Detailed side-by-side comparison of XC5VLX30-2FF324C by AMD and XC5VLX30-2FF324I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC5VLX30-2FF324C | XC5VLX30-2FF324I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Unknown | Obsolete |
| Device Type | Virtex-5 LX field-programmable gate array (FPGA) | Virtex-5 LX field-programmable gate array (FPGA) |
| Logic Cells | 30,720 cells | — |
| Configurable I/O | 220 I/O | — |
| Package | 324-terminal FCBGA | 324-ball FCBGA |
| Package Dimensions | 19 mm x 19 mm | 19 mm x 19 mm |
| Core Supply Voltage | 1 V | 1 V |
| Operating Supply Range | 0.95 V to 1.05 V | — |
| Process Technology | 65 nm CMOS | — |
| Architecture | Second-generation ASMBL column-based FPGA architecture | — |
| Minimum Operating Temperature | 0°C | — |
| Maximum Operating Temperature | 85°C | — |
| Terminal Count | 324 terminals | 324 terminals |
| Terminal Type | Ball | — |
| Package Shape | Square | Square |
| Speed Grade | -2 | -2 |
| Temperature Grade | Commercial (C) | Industrial |
| RoHS Status | RoHS non-compliant | Compliant |
| Lead-Free Status | Contains lead | — |
| Configurable Logic Cells | — | 30,720 cells |
| Configurable Logic Blocks | — | 2,400 CLBs |
| User I/O | — | 220 I/O |
| Package Type | — | FCBGA-324 |
| Package Pitch | — | 1.0 mm |
| Technology | — | 65 nm |
| Operating Temperature | — | -40°C to 100°C |
| Mounting Type | — | Surface mount |
| Logic Element Count | — | [DATA_NEEDED: logic element count] |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slices | — | [DATA_NEEDED: DSP slice count] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |