XC5VLX30-2FF324I vs XC5VLX30-2FF324C Comparison
Detailed side-by-side comparison of XC5VLX30-2FF324I by AMD and XC5VLX30-2FF324C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC5VLX30-2FF324I | XC5VLX30-2FF324C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Unknown |
| Device Type | Virtex-5 LX field-programmable gate array (FPGA) | Virtex-5 LX field-programmable gate array (FPGA) |
| Configurable Logic Cells | 30,720 cells | — |
| Configurable Logic Blocks | 2,400 CLBs | — |
| User I/O | 220 I/O | — |
| Package | 324-ball FCBGA | 324-terminal FCBGA |
| Package Type | FCBGA-324 | — |
| Package Dimensions | 19 mm x 19 mm | 19 mm x 19 mm |
| Package Pitch | 1.0 mm | — |
| Terminal Count | 324 terminals | 324 terminals |
| Technology | 65 nm | — |
| Core Supply Voltage | 1 V | 1 V |
| Operating Temperature | -40°C to 100°C | — |
| Temperature Grade | Industrial | Commercial (C) |
| Speed Grade | -2 | -2 |
| Mounting Type | Surface mount | — |
| Package Shape | Square | Square |
| RoHS Status | Compliant | RoHS non-compliant |
| Logic Element Count | [DATA_NEEDED: logic element count] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slices | [DATA_NEEDED: DSP slice count] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Logic Cells | — | 30,720 cells |
| Configurable I/O | — | 220 I/O |
| Operating Supply Range | — | 0.95 V to 1.05 V |
| Process Technology | — | 65 nm CMOS |
| Architecture | — | Second-generation ASMBL column-based FPGA architecture |
| Minimum Operating Temperature | — | 0°C |
| Maximum Operating Temperature | — | 85°C |
| Terminal Type | — | Ball |
| Lead-Free Status | — | Contains lead |