XC5VLX30-2FF324I vs XC5VLX30-3FF324C Comparison

Detailed side-by-side comparison of XC5VLX30-2FF324I by AMD and XC5VLX30-3FF324C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC5VLX30-2FF324I XC5VLX30-3FF324C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Unknown
Device Type Virtex-5 LX field-programmable gate array (FPGA) Field Programmable Gate Array (FPGA)
Configurable Logic Cells 30,720 cells —
Configurable Logic Blocks 2,400 CLBs —
User I/O 220 I/O —
Package 324-ball FCBGA 324-BBGA, FCBGA
Package Type FCBGA-324 —
Package Dimensions 19 mm x 19 mm [DATA_NEEDED: package dimensions]
Package Pitch 1.0 mm —
Terminal Count 324 terminals —
Technology 65 nm —
Core Supply Voltage 1 V [DATA_NEEDED: core supply voltage]
Operating Temperature -40°C to 100°C —
Temperature Grade Industrial —
Speed Grade -2 -3
Mounting Type Surface mount Surface Mount (BGA)
Package Shape Square Square
RoHS Status Compliant RoHS Non-Compliant
Logic Element Count [DATA_NEEDED: logic element count] —
Block RAM [DATA_NEEDED: block RAM capacity] 1,179,648 bits (1.125 Mbit)
DSP Slices [DATA_NEEDED: DSP slice count] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
Family — Virtex-5 LX
Manufacturer — AMD / Xilinx
Number of Logic Cells — 30,720
Number of I/O — 220
Number of Terminals — 324
Terminal Form — Ball
Architecture — ASMBL column-based, second generation
Lead Free Status — Contains Lead
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Number of DSP Slices — [DATA_NEEDED: number of DSP48 slices]
Number of Configuration Pins — [DATA_NEEDED: configuration pin count]

Datasheets & Resources

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