XC5VLX30-2FF676C vs XC5VLX30-1FF676C Comparison

Detailed side-by-side comparison of XC5VLX30-2FF676C by AMD and XC5VLX30-1FF676C by Xilinx. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC5VLX30-2FF676C XC5VLX30-1FF676C
Brand AMD Xilinx
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Active
Device Type Virtex-5 LX field-programmable gate array Virtex-5 LX Field Programmable Gate Array (FPGA)
Logic Cells 30,720 cells 30,720
Number of I/O 400 I/O —
Package 676-BBGA FCBGA 676-BBGA (FCBGA), 676 balls
Number of Terminals 676 terminals 676
Package Type BGA —
Process Technology 65 nm CMOS —
Supply Voltage 1 V —
Speed Grade -2 -1
FPGA Architecture Second-generation ASMBL column-based architecture —
Programmable Logic Blocks 2,400 CLBs —
Maximum Frequency 1,098 MHz —
Package Dimensions 27 x 27 mm —
Mounting Style Surface mount —
Lead-Free Status Contains lead —
RoHS Status RoHS non-compliant RoHS Non-Compliant
Operating Temperature [DATA_NEEDED: operating temperature range] —
Block RAM [DATA_NEEDED: block RAM capacity] [DATA_NEEDED: block RAM quantity]
DSP Resources [DATA_NEEDED: DSP resource count] —
Number of Gates — 1,179,648
User I/O — 400
Terminal Form — Ball (BGA)
Package Shape — Square
Architecture — ASMBL column-based FPGA, 2nd generation
Temperature Grade — Commercial
Configuration Memory — SRAM-based, volatile (bitstream reload required at power-up)
Lead Free Status — Contains Lead
Manufacturer — AMD / Xilinx
DSP48E Slices — [DATA_NEEDED: DSP48E slice count]
I/O Standards — [DATA_NEEDED: supported I/O standards]
Supply Voltage Range — [DATA_NEEDED: core and I/O supply voltages]
Operating Temperature Range — [DATA_NEEDED: commercial junction/ambient temperature range]

Datasheets & Resources

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