XC5VLX30-3FF324C vs XC5VLX30-2FF324C Comparison

Detailed side-by-side comparison of XC5VLX30-3FF324C by AMD and XC5VLX30-2FF324C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC5VLX30-3FF324C XC5VLX30-2FF324C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Unknown
Device Type Field Programmable Gate Array (FPGA) Virtex-5 LX field-programmable gate array (FPGA)
Family Virtex-5 LX —
Manufacturer AMD / Xilinx —
Number of Logic Cells 30,720 —
Number of I/O 220 —
Block RAM 1,179,648 bits (1.125 Mbit) —
Package 324-BBGA, FCBGA 324-terminal FCBGA
Number of Terminals 324 —
Terminal Form Ball —
Package Shape Square Square
Speed Grade -3 -2
Architecture ASMBL column-based, second generation Second-generation ASMBL column-based FPGA architecture
Mounting Type Surface Mount (BGA) —
RoHS Status RoHS Non-Compliant RoHS non-compliant
Lead Free Status Contains Lead —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] 1 V
Package Dimensions [DATA_NEEDED: package dimensions] 19 mm x 19 mm
Number of DSP Slices [DATA_NEEDED: number of DSP48 slices] —
Number of Configuration Pins [DATA_NEEDED: configuration pin count] —
Logic Cells — 30,720 cells
Configurable I/O — 220 I/O
Operating Supply Range — 0.95 V to 1.05 V
Process Technology — 65 nm CMOS
Minimum Operating Temperature — 0°C
Maximum Operating Temperature — 85°C
Terminal Count — 324 terminals
Terminal Type — Ball
Temperature Grade — Commercial (C)
Lead-Free Status — Contains lead

Datasheets & Resources

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