XC5VLX30-3FF324C vs XC5VLX30-2FF324I Comparison

Detailed side-by-side comparison of XC5VLX30-3FF324C by AMD and XC5VLX30-2FF324I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC5VLX30-3FF324C XC5VLX30-2FF324I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Obsolete
Device Type Field Programmable Gate Array (FPGA) Virtex-5 LX field-programmable gate array (FPGA)
Family Virtex-5 LX —
Manufacturer AMD / Xilinx —
Number of Logic Cells 30,720 —
Number of I/O 220 —
Block RAM 1,179,648 bits (1.125 Mbit) [DATA_NEEDED: block RAM capacity]
Package 324-BBGA, FCBGA 324-ball FCBGA
Number of Terminals 324 —
Terminal Form Ball —
Package Shape Square Square
Speed Grade -3 -2
Architecture ASMBL column-based, second generation —
Mounting Type Surface Mount (BGA) Surface mount
RoHS Status RoHS Non-Compliant Compliant
Lead Free Status Contains Lead —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] 1 V
Package Dimensions [DATA_NEEDED: package dimensions] 19 mm x 19 mm
Number of DSP Slices [DATA_NEEDED: number of DSP48 slices] —
Number of Configuration Pins [DATA_NEEDED: configuration pin count] —
Configurable Logic Cells — 30,720 cells
Configurable Logic Blocks — 2,400 CLBs
User I/O — 220 I/O
Package Type — FCBGA-324
Package Pitch — 1.0 mm
Terminal Count — 324 terminals
Technology — 65 nm
Operating Temperature — -40°C to 100°C
Temperature Grade — Industrial
Logic Element Count — [DATA_NEEDED: logic element count]
DSP Slices — [DATA_NEEDED: DSP slice count]
I/O Standard — [DATA_NEEDED: supported I/O standards]

Datasheets & Resources

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