XC5VLX50-1FF676I vs XC5VLX50-3FF676C Comparison

Detailed side-by-side comparison of XC5VLX50-1FF676I by AMD and XC5VLX50-3FF676C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC5VLX50-1FF676I XC5VLX50-3FF676C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Virtex-5 LX field-programmable gate array (FPGA) Virtex-5 LX Field Programmable Gate Array (FPGA)
Logic Cells 46,080 cells 46,080
Configurable Logic Blocks 3,600 CLBs —
User I/O 440 I/O —
Process Technology 65 nm CMOS 65 nm CMOS
Maximum Supply Voltage 1.05 V —
Operating Temperature -40°C to +100°C —
Package 676-pin BBGA/FCBGA 676-FCBGA (27 x 27 mm), BBGA / FCBGA
Mounting Type Surface mount Surface Mount
FPGA Family Virtex-5 LX —
Programmable Logic Type SRAM-configured FPGA —
Logic Cell Count 46,080 cells —
Configurable Logic Block Count 3,600 blocks —
I/O Count 440 I/O —
Nominal Supply Voltage 1 V —
Temperature Class -40°C to +100°C —
Lead-Free Status [DATA_NEEDED: lead-free status] —
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Look-Up Tables (LUTs) — 3,600
User I/O Pins — 440
Total RAM Bits — 1,769,472 bits
Core Supply Voltage Range — 0.95 V to 1.05 V (1.0 V nominal)
Operating Junction Temperature Range — 0 °C to +85 °C
Number of Terminals — 676 balls
Terminal / Pitch Type — Ball (BGA), square package
Family — Virtex-5 LX
Speed Grade — -3
Temperature Grade — Commercial (C)
Number of Slices — [DATA_NEEDED: number of slices]
DSP48 Slices — [DATA_NEEDED: DSP48 slice count]
Number of Block RAM Blocks — [DATA_NEEDED: block RAM count]
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
Configuration Support — [DATA_NEEDED: configuration interface details]

Datasheets & Resources

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