XC5VLX50-2FF676C vs XC5VLX50-3FF676C Comparison

Detailed side-by-side comparison of XC5VLX50-2FF676C by AMD and XC5VLX50-3FF676C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC5VLX50-2FF676C XC5VLX50-3FF676C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Device Type Virtex-5 LX FPGA Virtex-5 LX Field Programmable Gate Array (FPGA)
Number of Logic Cells 46,080 cells —
Number of I/O 440 I/O —
Process Technology 65 nm CMOS 65 nm CMOS
Core Supply Voltage 1 V —
Speed Grade -2 -3
Package Type 676-ball FCBGA —
Number of Package Balls 676 balls —
Mounting Type Surface mount Surface Mount
Package Body Dimensions [DATA_NEEDED: package body dimensions] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP48 Slices [DATA_NEEDED: DSP48 slice count] [DATA_NEEDED: DSP48 slice count]
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Configuration Memory [DATA_NEEDED: configuration memory] —
RoHS Status RoHS non-compliant —
Lead-Free Status Contains lead —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification Not applicable —
Logic Cells — 46,080
Look-Up Tables (LUTs) — 3,600
User I/O Pins — 440
Total RAM Bits — 1,769,472 bits
Core Supply Voltage Range — 0.95 V to 1.05 V (1.0 V nominal)
Operating Junction Temperature Range — 0 °C to +85 °C
Package — 676-FCBGA (27 x 27 mm), BBGA / FCBGA
Number of Terminals — 676 balls
Terminal / Pitch Type — Ball (BGA), square package
Family — Virtex-5 LX
Temperature Grade — Commercial (C)
Number of Slices — [DATA_NEEDED: number of slices]
Number of Block RAM Blocks — [DATA_NEEDED: block RAM count]
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
Configuration Support — [DATA_NEEDED: configuration interface details]

Datasheets & Resources

Browse All Products Create BOM Request Quote