XC5VLX50-3FF676C vs XC5VLX50-1FF676C Comparison

Detailed side-by-side comparison of XC5VLX50-3FF676C by AMD and XC5VLX50-1FF676C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC5VLX50-3FF676C XC5VLX50-1FF676C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Device Type Virtex-5 LX Field Programmable Gate Array (FPGA) Field Programmable Gate Array (FPGA)
Logic Cells 46,080 46,080 cells
Look-Up Tables (LUTs) 3,600 —
User I/O Pins 440 —
Total RAM Bits 1,769,472 bits —
Core Supply Voltage Range 0.95 V to 1.05 V (1.0 V nominal) —
Operating Junction Temperature Range 0 °C to +85 °C —
Process Technology 65 nm CMOS 65 nm CMOS
Package 676-FCBGA (27 x 27 mm), BBGA / FCBGA —
Number of Terminals 676 balls —
Terminal / Pitch Type Ball (BGA), square package —
Mounting Type Surface Mount —
Family Virtex-5 LX —
Speed Grade -3 -1
Temperature Grade Commercial (C) —
Number of Slices [DATA_NEEDED: number of slices] —
DSP48 Slices [DATA_NEEDED: DSP48 slice count] —
Number of Block RAM Blocks [DATA_NEEDED: block RAM count] —
Number of I/O Banks [DATA_NEEDED: I/O bank count] —
Configuration Support [DATA_NEEDED: configuration interface details] —
FPGA Family — Virtex-5 LX
User I/O — 440 I/O
Package Type — 676-FCBGA
Total Terminals — 676 terminals
Package Code — BGA
Package Shape — Square
Terminal Form — Ball
Listed Operating Voltage — 1 V
Architecture — Second-generation ASMBL column-based FPGA architecture
Lead-Free Status — Contains lead
RoHS Status — RoHS non-compliant
Mounting Technology — Surface-mount ball-grid array

Datasheets & Resources

Browse All Products Create BOM Request Quote