XC6SLX100-2FG676I vs XC6SLX100-2FGG676C Comparison

Detailed side-by-side comparison of XC6SLX100-2FG676I by AMD and XC6SLX100-2FGG676C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX100-2FG676I XC6SLX100-2FGG676C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Spartan-6 LX —
Logic Cells 101261 cells 101,261
User I/O 480 I/O —
Internal Frequency 667 MHz —
Speed Grade -2 -2
Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Package 676-BGA FBGA-676 (FGG676) 27x27 mm
Package Type Flip-chip BGA —
Package Ball Pitch 1.0 mm —
Package Dimensions 27 x 27 mm —
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature Range -40 °C to 100 °C (TJ) —
Technology Node 45 nm —
Programming Technology SRAM configurable FPGA —
Lead-Free Status Lead-free —
RoHS Status [DATA_NEEDED: RoHS compliance] Compliant
REACH Status [DATA_NEEDED: REACH compliance] —
Automotive Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Block RAM [DATA_NEEDED: block RAM capacity] 3.8 Mb (4824 Kbits)
Family — Spartan-6 LX
System Gates — 4,939,776
Slices — 15,822
DSP Slices — 180 DSP48A1
Maximum User I/O — 480
Maximum I/O Banks — 6
Temperature Grade — Commercial (0 C to +85 C)
Ball Pitch — 0.8 mm
Core Voltage — 1.2 V
Process Technology — 45 nm CMOS
Lead Free — Yes

Datasheets & Resources

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