XC6SLX100-2FG676I vs XC6SLX100-3FG676I Comparison
Detailed side-by-side comparison of XC6SLX100-2FG676I by AMD and XC6SLX100-3FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX100-2FG676I | XC6SLX100-3FG676I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-6 LX Field Programmable Gate Array |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 101261 cells | 101,261 cells |
| User I/O | 480 I/O | — |
| Internal Frequency | 667 MHz | — |
| Speed Grade | -2 | -3 performance grade |
| Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | 1.2 V nominal |
| Package | 676-BGA | — |
| Package Type | Flip-chip BGA | 676-ball BGA |
| Package Ball Pitch | 1.0 mm | — |
| Package Dimensions | 27 x 27 mm | 27 mm x 27 mm |
| Mounting Type | Surface Mount | Surface-mount BGA |
| Operating Temperature Range | -40 °C to 100 °C (TJ) | — |
| Technology Node | 45 nm | — |
| Programming Technology | SRAM configurable FPGA | — |
| Lead-Free Status | Lead-free | Lead-free package |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | Compliant |
| REACH Status | [DATA_NEEDED: REACH compliance] | — |
| Automotive Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| Adaptive Logic Modules | — | 7,911 CLBs |
| Total RAM Bits | — | 4,939,776 bits |
| Maximum I/O | — | 480 I/O |
| Process Technology | — | 45 nm CMOS |
| Temperature Grade | — | Industrial grade |
| Package Family | — | FBGA |
| Ball Pitch | — | 1 mm |
| Terminal Count | — | 676 terminals |
| Terminal Type | — | Ball |
| Maximum Internal Frequency | — | 862 MHz |
| Programming | — | AMD/Xilinx configuration bitstream |