XC6SLX100-3FG676I vs XC6SLX100-2FG676I Comparison

Detailed side-by-side comparison of XC6SLX100-3FG676I by AMD and XC6SLX100-2FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX100-3FG676I XC6SLX100-2FG676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field Programmable Gate Array Field Programmable Gate Array (FPGA)
Logic Cells 101,261 cells 101261 cells
Adaptive Logic Modules 7,911 CLBs —
Total RAM Bits 4,939,776 bits —
Maximum I/O 480 I/O —
Process Technology 45 nm CMOS —
Core Supply Voltage 1.2 V nominal 1.2 V
Speed Grade -3 performance grade -2
Temperature Grade Industrial grade —
Package Type 676-ball BGA Flip-chip BGA
Package Family FBGA —
Package Dimensions 27 mm x 27 mm 27 x 27 mm
Ball Pitch 1 mm —
Terminal Count 676 terminals —
Terminal Type Ball —
Mounting Type Surface-mount BGA Surface Mount
Lead-Free Status Lead-free package Lead-free
RoHS Status Compliant [DATA_NEEDED: RoHS compliance]
Maximum Internal Frequency 862 MHz —
Programming AMD/Xilinx configuration bitstream —
FPGA Family — Spartan-6 LX
User I/O — 480 I/O
Internal Frequency — 667 MHz
Technology — 45 nm CMOS
Package — 676-BGA
Package Ball Pitch — 1.0 mm
Operating Temperature Range — -40 °C to 100 °C (TJ)
Technology Node — 45 nm
Programming Technology — SRAM configurable FPGA
REACH Status — [DATA_NEEDED: REACH compliance]
Automotive Qualification — [DATA_NEEDED: AEC-Q100 qualification]
Block RAM — [DATA_NEEDED: block RAM capacity]

Datasheets & Resources

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