XC6SLX100-3FG676I vs XC6SLX100-2FGG676C Comparison

Detailed side-by-side comparison of XC6SLX100-3FG676I by AMD and XC6SLX100-2FGG676C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX100-3FG676I XC6SLX100-2FGG676C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field Programmable Gate Array —
Logic Cells 101,261 cells 101,261
Adaptive Logic Modules 7,911 CLBs —
Total RAM Bits 4,939,776 bits —
Maximum I/O 480 I/O —
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V nominal —
Speed Grade -3 performance grade -2
Temperature Grade Industrial grade Commercial (0 C to +85 C)
Package Type 676-ball BGA —
Package Family FBGA —
Package Dimensions 27 mm x 27 mm —
Ball Pitch 1 mm 0.8 mm
Terminal Count 676 terminals —
Terminal Type Ball —
Mounting Type Surface-mount BGA Surface Mount (BGA)
Lead-Free Status Lead-free package —
RoHS Status Compliant Compliant
Maximum Internal Frequency 862 MHz —
Programming AMD/Xilinx configuration bitstream —
Family — Spartan-6 LX
System Gates — 4,939,776
Slices — 15,822
Block RAM — 3.8 Mb (4824 Kbits)
DSP Slices — 180 DSP48A1
Maximum User I/O — 480
Maximum I/O Banks — 6
Package — FBGA-676 (FGG676) 27x27 mm
Core Voltage — 1.2 V
Lead Free — Yes

Datasheets & Resources

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