XC6SLX150-2FG484I vs XC6SLX150-3FG484C Comparison
Detailed side-by-side comparison of XC6SLX150-2FG484I by AMD and XC6SLX150-3FG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX150-2FG484I | XC6SLX150-3FG484C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Active |
| Device Type | Spartan-6 LX Field Programmable Gate Array | Field Programmable Gate Array (FPGA) |
| Logic Elements | 147,443 cells | — |
| Logic Cells | 11,519 cells | 147,443 cells |
| RAM | 4,939,776 bits | — |
| Number of I/O | 338 I/O | — |
| Package | 484-ball BGA, 19 mm x 19 mm | — |
| Package Ball Pitch | 0.80 mm | — |
| Mounting Type | Surface Mount | Surface Mount |
| Internal Frequency | 667 MHz | 667 MHz |
| Speed Grade | -2 | -3 |
| Core Supply Voltage | 1.14 V to 1.26 V | 1.2 V |
| Operating Temperature | [DATA_NEEDED: XC6SLX150-2FG484I operating temperature range] | 0°C to 85°C |
| Device Family | Spartan-6 LX | — |
| Programmability | User-programmable FPGA | — |
| Embedded Memory | 4,939,776 RAM bits | — |
| Manufacturer | AMD / Xilinx | — |
| Lead-Free Package | Yes | — |
| Package Length | 19 mm | — |
| Package Width | 19 mm | — |
| FPGA Family | — | Spartan-6 LX |
| Configurable Logic Blocks | — | 11,519 CLBs |
| I/O Count | — | 338 I/O |
| Process Technology | — | 45 nm CMOS |
| Package Type | — | 484-ball CSBGA |
| Package Dimensions | — | 19 mm x 19 mm |
| Package Pitch | — | 0.80 mm |
| Pin Count | — | 484 balls |
| Lead-Free Status | — | Lead-free |
| Programmable Interface | — | [DATA_NEEDED: programmable interface type] |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slices | — | [DATA_NEEDED: DSP slice count] |
| Maximum I/O Frequency | — | [DATA_NEEDED: maximum I/O frequency] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type] |