XC6SLX150-3FG484C vs XC6SLX150-2FG484I Comparison

Detailed side-by-side comparison of XC6SLX150-3FG484C by AMD and XC6SLX150-2FG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX150-3FG484C XC6SLX150-2FG484I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Device Type Field Programmable Gate Array (FPGA) Spartan-6 LX Field Programmable Gate Array
FPGA Family Spartan-6 LX —
Logic Cells 147,443 cells 11,519 cells
Configurable Logic Blocks 11,519 CLBs —
Internal Frequency 667 MHz 667 MHz
I/O Count 338 I/O —
Process Technology 45 nm CMOS —
Core Supply Voltage 1.2 V 1.14 V to 1.26 V
Speed Grade -3 -2
Package Type 484-ball CSBGA —
Package Dimensions 19 mm x 19 mm —
Package Pitch 0.80 mm —
Pin Count 484 balls —
Operating Temperature 0°C to 85°C [DATA_NEEDED: XC6SLX150-2FG484I operating temperature range]
Mounting Type Surface Mount Surface Mount
Lead-Free Status Lead-free —
Programmable Interface [DATA_NEEDED: programmable interface type] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Slices [DATA_NEEDED: DSP slice count] —
Maximum I/O Frequency [DATA_NEEDED: maximum I/O frequency] —
Configuration Memory [DATA_NEEDED: configuration memory type] —
Logic Elements — 147,443 cells
RAM — 4,939,776 bits
Number of I/O — 338 I/O
Package — 484-ball BGA, 19 mm x 19 mm
Package Ball Pitch — 0.80 mm
Device Family — Spartan-6 LX
Programmability — User-programmable FPGA
Embedded Memory — 4,939,776 RAM bits
Manufacturer — AMD / Xilinx
Lead-Free Package — Yes
Package Length — 19 mm
Package Width — 19 mm

Datasheets & Resources

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