XC6SLX16-3CSG225I vs XC6SLX16-3CSG225C Comparison
Detailed side-by-side comparison of XC6SLX16-3CSG225I by AMD and XC6SLX16-3CSG225C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX16-3CSG225I | XC6SLX16-3CSG225C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Spartan-6 LX Field-Programmable Gate Array (FPGA) | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 14,579 cells | — |
| Adaptive Logic Modules | 2,278 ALMs | 2,278 ALM |
| Configurable Logic Blocks | 1,139 CLBs | — |
| User I/O | 160 I/O | 160 I/O |
| Embedded Memory | 576 kbit | 576 Kbit |
| Hardware Multipliers | 24 multipliers | — |
| Maximum Internal Frequency | 862 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm |
| Core Supply Voltage | 1.2 V | [DATA_NEEDED: Core supply voltage] |
| Package | 225-LFBGA, CSPBGA | 225-LFBGA, CSPBGA |
| Package Body Size | 13 mm × 13 mm | — |
| Ball Pitch | 0.80 mm | — |
| Number of Pins or Balls | 225 pins | — |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C |
| Speed Grade | -3 performance grade | -3 |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Lead Free | Lead-free package |
| Logic Elements | — | 14,579 LE |
| Embedded Memory in Bits | — | 589,824 bit |
| Internal Frequency | — | 667 MHz |
| Temperature Grade | — | Commercial |
| Package Ball Pitch | — | 0.80 mm |
| Package Dimension | — | 19 mm × 19 mm |
| Mounting Type | — | Surface-mount BGA |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |