XC6SLX16-3CSG324I vs XC6SLX16-3CSG324C Comparison
Detailed side-by-side comparison of XC6SLX16-3CSG324I by AMD and XC6SLX16-3CSG324C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX16-3CSG324I | XC6SLX16-3CSG324C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | FPGA | Spartan-6 LX field-programmable gate array |
| FPGA Family | Spartan-6 LX | — |
| Manufacturing Technology | 45 nm | — |
| Logic Cells | 14,579 cells | 14,579 cells |
| Number of LABs/CLBs | 1,139 LABs/CLBs | — |
| Total RAM | 589,824 bits | — |
| Number of I/O | 232 I/Os | — |
| Internal Frequency | 667 MHz | 667 MHz |
| Operating Frequency | 400 MHz | — |
| Supply Voltage | 1.14 V to 1.26 V | — |
| Speed Grade | -3 | — |
| Operating Temperature Range | -40 °C to 100 °C junction | — |
| Commercial Ambient Temperature | 0 °C to 85 °C | — |
| Package | 324-ball CSBGA, 19 mm × 19 mm | 324-CSPBGA |
| Ball Pitch | 0.80 mm | — |
| Mounting Type | Surface mount | Surface Mount |
| Lead-Free Status | Lead free | Lead-free |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH compliance status] |
| LABs and CLBs | — | 1,139 LABs and CLBs |
| Embedded RAM | — | 589,824 bits |
| User I/O | — | 232 I/O |
| Process Technology | — | 45 nm |
| Operating Supply Voltage | — | 1.14 V to 1.26 V |
| Operating Temperature | — | 0 °C to 85 °C |
| Package Ball Count | — | 324 balls |
| Package Body Dimensions | — | [DATA_NEEDED: verified CSG324 package body dimensions] |
| Package Ball Pitch | — | [DATA_NEEDED: verified CSG324 ball pitch] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |