XC6SLX16-3FT256I vs XC6SLX16-3FTG256C Comparison
Detailed side-by-side comparison of XC6SLX16-3FT256I by AMD and XC6SLX16-3FTG256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX16-3FT256I | XC6SLX16-3FTG256C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-6 LX (logic-optimized) | — |
| Logic Cells | 14,579 cells | 14,579 |
| Configurable Logic Blocks (CLBs) | 1,139 CLBs | 1139 |
| User I/O Count | 186 I/O | — |
| Max Internal Frequency | 667 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | -3 (highest Spartan-6 LX performance grade) | -3 |
| Package | 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid | 256-LBGA / FTBGA-256, 17 x 17 mm, 1.0 mm pitch |
| Package Body Size | 17 x 17 mm, 1.0 mm ball pitch | — |
| Terminal Count | 256 terminals | — |
| Operating Temperature | 0 C to +85 C (32 F to 185 F) | 0 C to +85 C (Commercial) |
| Temperature Grade Marking | Industrial | — |
| Lead-Free Status | Lead-free package construction | — |
| Mounting Type | Surface Mount | Surface Mount |
| Package Code | LBGA / FT256 | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| Configuration Interface Details | [DATA_NEEDED: configuration interface details] | — |
| Family | — | Spartan-6 LX |
| Series | — | XC6SLX16 |
| Distributed RAM | — | 256 kbit |
| Block RAM | — | [DATA_NEEDED: total Kbits] |
| DSP48A1 Slices | — | 32 |
| Maximum User I/Os | — | 186 |
| User I/O Banks | — | [DATA_NEEDED: count] |
| Number of CMTs | — | 2 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Auxiliary Voltage (VCCAUX) | — | 2.5 V to 3.3 V |
| RoHS Status | — | Compliant |