XC6SLX16-L1FT256I vs XC6SLX16-2FTG256I Comparison
Detailed side-by-side comparison of XC6SLX16-L1FT256I by AMD and XC6SLX16-2FTG256I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX16-L1FT256I | XC6SLX16-2FTG256I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last Time Buy |
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| Logic Cell Count | 14,579 cells | — |
| Configurable Logic Block Count | 1,139 CLBs | — |
| Process Technology | 45 nm CMOS | CMOS |
| Supply Voltage | 1 V | — |
| Package | 256-pin FTBGA | FTGBGA-256 |
| Package Dimensions | 17 mm x 17 mm | — |
| Ball Pitch | 1 mm | — |
| Terminal Type | Ball | — |
| Number of Terminals | 256 terminals | — |
| Temperature Grade | Industrial | — |
| Speed Grade | L1 | -2 |
| Programmable Logic Type | FPGA | — |
| Device Family | Spartan-6 LX | — |
| Lead-Free Status | Lead free | Lead free |
| Package Mounting Style | Surface mount | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | [DATA_NEEDED: AEC-Q100 qualification] |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| I/O Count | [DATA_NEEDED: user I/O count] | — |
| Packaging Quantity | [DATA_NEEDED: standard packaging quantity] | — |
| FPGA Family | — | Spartan-6 LX |
| Logic Cells | — | 14,579 cells |
| Configurable Logic Blocks | — | 1,139 CLBs |
| Adaptive Logic Modules | — | 2,278 ALMs |
| User I/Os | — | 186 I/Os |
| Internal Frequency | — | 667 MHz |
| Additional Stated Frequency | — | 375 MHz |
| Core Supply Voltage | — | 1.14 V to 1.26 V |
| Package Body Size | — | 17 mm x 17 mm |
| Package Ball Pitch | — | 1.00 mm |
| Operating Temperature | — | 0°C to 85°C |
| Embedded Resources | — | DCM, PLL, block RAM, and DSP |