XC6SLX25-2FGG484C vs XC6SLX25-3FG484C Comparison
Detailed side-by-side comparison of XC6SLX25-2FGG484C by AMD and XC6SLX25-3FG484C by Advanced Micro Devices, Inc.. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Advanced Micro Devices, Inc.
XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx
XC6SLX25-3FG484C ✓ ActiveSpecification Comparison
| Parameter | XC6SLX25-2FGG484C | XC6SLX25-3FG484C |
|---|---|---|
| Brand | AMD | Advanced Micro Devices, Inc. |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | FPGA | FPGA |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24,051 cells | 24,051 cells |
| Configurable Logic Blocks | 1,879 CLBs | 1,879 CLBs |
| Internal Frequency | 500 MHz | 500 MHz |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Operating Temperature | 0°C to 85°C | 0 °C to 85 °C |
| Package Type | Lead-free 484-BBGA | — |
| Package Dimensions | 15 mm x 15 mm | — |
| Ball Pitch | 0.80 mm | — |
| Ball Count | 484 balls | — |
| Speed Grade | -2 | -3 |
| Temperature Grade | Commercial | — |
| Mounting Type | Surface Mount | Surface Mount |
| Hot-Swap Support | Supported | — |
| AES Encryption Support | Supported | — |
| RoHS Status | Compliant | Compliant |
| Package | — | 484-BBGA, 15 x 15 mm, 0.80 mm pitch |
| Package Classification | — | Lead-free CSBGA-324 |
| Metal Balls | — | 266 balls |
| Package Reference | — | MO-275 |