XC6SLX25-3CSG324I vs XC6SLX45-3CSG324I Comparison
Detailed side-by-side comparison of XC6SLX25-3CSG324I by AMD and XC6SLX45-3CSG324I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX25-3CSG324I | XC6SLX45-3CSG324I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Spartan-6 LX FPGA | Spartan-6 LX FPGA |
| Programmable Logic Cells | 24,051 cells | — |
| Internal Frequency | 500 MHz | — |
| Speed Grade | -3 | -3 |
| Package Type | 324-LFBGA, CSPBGA | — |
| Package Dimensions | 15 x 15 mm | — |
| Package Pitch | 0.80 mm | — |
| Package Designation | MO-275 | — |
| Number of Pins | 324 pins | — |
| Operating Temperature | 0 C to 85 C | — |
| Lead-Free Package | Lead-free | — |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Manufacturer | AMD/Xilinx | — |
| Mounting Type | Surface Mount | Surface mount |
| Catalog Number | XC6SLX25-3CSG324I | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | RoHS Compliant |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Logic Cells | — | 43,661 |
| Number of I/O | — | 218 |
| Process Technology | — | 45 nm |
| Core Supply Voltage | — | 1.2 V |
| Temperature Grade | — | Industrial, -40°C to +100°C |
| Package | — | 324-LFBGA CSPBGA |
| Package Designator | — | CSG324 |
| Programmable Logic Type | — | FPGA |
| Lead-Free Status | — | Lead Free |
| Reachable Component Status | — | Active |
| Number of Dedicated I/O Banks | — | [DATA_NEEDED: number of dedicated I/O banks] |
| Block RAM | — | [DATA_NEEDED: block RAM resources] |
| DSP Slices | — | [DATA_NEEDED: DSP slice count] |
| Maximum Clock Frequency | — | [DATA_NEEDED: maximum clock frequency] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory] |