XC6SLX25-3FGG484C vs XC6SLX25-2FG484C Comparison
Detailed side-by-side comparison of XC6SLX25-3FGG484C by AMD and XC6SLX25-2FG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX25-3FGG484C | XC6SLX25-2FG484C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Manufacturer | AMD / Xilinx | — |
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) | Field-Programmable Gate Array (FPGA) |
| Logic Cell Count | 24,051 cells | — |
| User I/O Count | 266 I/O | — |
| Process Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Package | 484-pin FBGA | — |
| Package Type | FBGA | 484-pin FBGA |
| Number of Package Balls or Pins | 484 | — |
| Programmable Logic Type | FPGA | — |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -2 |
| Mounting Type | Surface mount | Surface mount |
| Device Category | Programmable logic device | — |
| RoHS Status | RoHS compliant | RoHS compliant |
| Lead-Free Status | Lead free | Lead-free |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Maximum I/O Performance | [DATA_NEEDED: maximum I/O performance] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| Product Lifecycle Status | [DATA_NEEDED: product lifecycle status] | — |
| Logic Cells | — | 24,051 cells |
| Number of I/O | — | 266 I/O |
| Internal Frequency | — | 500 MHz |
| Technology | — | 45 nm CMOS |
| Number of Package Balls | — | 484 balls |
| Terminal Type | — | Ball |
| Package Shape | — | Square |
| Operating Temperature | — | 0°C to 85°C |