XC6SLX25-3FGG484C vs XC6SLX25-3FG484C Comparison
Detailed side-by-side comparison of XC6SLX25-3FGG484C by AMD and XC6SLX25-3FG484C by Advanced Micro Devices, Inc.. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Advanced Micro Devices, Inc.
XC6SLX25-3FG484C - Spartan-6 LX FPGA | AMD Xilinx
XC6SLX25-3FG484C ✓ ActiveSpecification Comparison
| Parameter | XC6SLX25-3FGG484C | XC6SLX25-3FG484C |
|---|---|---|
| Brand | AMD | Advanced Micro Devices, Inc. |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Manufacturer | AMD / Xilinx | — |
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) | FPGA |
| Logic Cell Count | 24,051 cells | — |
| User I/O Count | 266 I/O | — |
| Process Technology | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Package | 484-pin FBGA | 484-BBGA, 15 x 15 mm, 0.80 mm pitch |
| Package Type | FBGA | — |
| Number of Package Balls or Pins | 484 | — |
| Programmable Logic Type | FPGA | — |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -3 |
| Mounting Type | Surface mount | Surface Mount |
| Device Category | Programmable logic device | — |
| RoHS Status | RoHS compliant | Compliant |
| Lead-Free Status | Lead free | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Maximum I/O Performance | [DATA_NEEDED: maximum I/O performance] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slice Count | [DATA_NEEDED: DSP slice count] | — |
| Product Lifecycle Status | [DATA_NEEDED: product lifecycle status] | — |
| Logic Cells | — | 24,051 cells |
| Configurable Logic Blocks | — | 1,879 CLBs |
| Internal Frequency | — | 500 MHz |
| Operating Temperature | — | 0 °C to 85 °C |
| Package Classification | — | Lead-free CSBGA-324 |
| Metal Balls | — | 266 balls |
| Package Reference | — | MO-275 |