XC6SLX25T-2FG484C vs XC6SLX25T-3FG484I Comparison

Detailed side-by-side comparison of XC6SLX25T-2FG484C by AMD and XC6SLX25T-3FG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX25T-2FG484C XC6SLX25T-2FG484C - Spartan-6 LXT 24K FPGA | AMD

XC6SLX25T-2FG484C - Spartan-6 LXT 24K FPGA | AMD

XC6SLX25T-2FG484C ✓ Active

Specification Comparison

Parameter XC6SLX25T-2FG484C XC6SLX25T-3FG484I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) FPGA
FPGA Family Spartan-6 LXT Spartan-6 LXT
Logic Cells 24,051 cells 24,051 cells
Internal Frequency 500 MHz 500 MHz
Process Technology 45 nm CMOS —
Core Supply Voltage 1.2 V 1.2 V
Speed Grade -2 -3
Package 484-pin FBGA —
Package Dimensions 15 x 15 mm —
Package Pitch 0.80 mm 0.80 mm
Lead-Free Package Yes —
Operating Temperature 0 C to +85 C —
Mounting Type Surface Mount Surface mount
I/O Standard [DATA_NEEDED: supported I/O standards] —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Resources [DATA_NEEDED: DSP slice count] —
High-Speed Serial Transceivers [DATA_NEEDED: transceiver count] —
Configuration [DATA_NEEDED: configuration modes] —
RoHS Status [DATA_NEEDED: RoHS compliance status] Lead-free package
REACH Status [DATA_NEEDED: REACH compliance status] [DATA_NEEDED: REACH status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
I/O Count — 250 I/O
Distributed Memory — 958,464 bits
Temperature Grade — Industrial, 0 to 85 °C
Package Type — Lead-free FBGA, MO-275 / CSBGA-324
Package Body Size — 15 x 15 mm
Reported Pin Count — 324 pins
Technology Node — [DATA_NEEDED: technology node]
Block RAM Capacity — [DATA_NEEDED: block RAM capacity]
DSP Slice Count — [DATA_NEEDED: DSP slice count]
Transceiver Count — [DATA_NEEDED: transceiver count]

Datasheets & Resources

Browse All Products Create BOM Request Quote