XC6SLX25T-3FG484I vs XC6SLX25T-2FG484C Comparison

Detailed side-by-side comparison of XC6SLX25T-3FG484I by AMD and XC6SLX25T-2FG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX25T-2FG484C XC6SLX25T-2FG484C - Spartan-6 LXT 24K FPGA | AMD

XC6SLX25T-2FG484C - Spartan-6 LXT 24K FPGA | AMD

XC6SLX25T-2FG484C ✓ Active

Specification Comparison

Parameter XC6SLX25T-3FG484I XC6SLX25T-2FG484C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type FPGA Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LXT Spartan-6 LXT
Logic Cells 24,051 cells 24,051 cells
I/O Count 250 I/O —
Internal Frequency 500 MHz 500 MHz
Core Supply Voltage 1.2 V 1.2 V
Distributed Memory 958,464 bits —
Speed Grade -3 -2
Temperature Grade Industrial, 0 to 85 °C —
Package Type Lead-free FBGA, MO-275 / CSBGA-324 —
Package Body Size 15 x 15 mm —
Package Pitch 0.80 mm 0.80 mm
Reported Pin Count 324 pins —
Mounting Type Surface mount Surface Mount
Technology Node [DATA_NEEDED: technology node] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Transceiver Count [DATA_NEEDED: transceiver count] —
RoHS Status Lead-free package [DATA_NEEDED: RoHS compliance status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
Process Technology — 45 nm CMOS
Package — 484-pin FBGA
Package Dimensions — 15 x 15 mm
Lead-Free Package — Yes
Operating Temperature — 0 C to +85 C
I/O Standard — [DATA_NEEDED: supported I/O standards]
Block RAM — [DATA_NEEDED: block RAM capacity]
DSP Resources — [DATA_NEEDED: DSP slice count]
High-Speed Serial Transceivers — [DATA_NEEDED: transceiver count]
Configuration — [DATA_NEEDED: configuration modes]

Datasheets & Resources

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