XC6SLX45-2FGG484C vs XC6SLX45-3FG484I Comparison
Detailed side-by-side comparison of XC6SLX45-2FGG484C by AMD and XC6SLX45-3FG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX45-2FGG484C | XC6SLX45-3FG484I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Product Series | Spartan-6 LX | — |
| Family | XC6SLX45 | — |
| Speed Grade | -2 | -3 |
| Logic Cells | 43,661 | — |
| System Gates | 2,138,112 | — |
| User I/O Pins | 316 | — |
| Block RAM | 2088 Kbit | — |
| DSP Slices | 58 (DSP48A1) | — |
| Clock Management Tiles (CMTs) | 4 | — |
| Core Voltage (Vccint) | 1.14 V to 1.26 V | — |
| Auxiliary Voltage (Vccaux) | 2.375 V to 2.625 V | — |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C |
| Package | FBGA-484 (FGG484), 23 x 23 mm, 1.0 mm pitch | — |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Spartan-6 LX |
| Number of I/O | — | 316 I/O |
| Internal Frequency | — | 500 MHz |
| Temperature Grade | — | Industrial |
| Package Type | — | 484-BBGA |
| Package Dimensions | — | 15 x 15 mm |
| Ball Pitch | — | 0.80 mm |
| Package Ball Count | — | 324 balls |
| Package Outline | — | MO-275 |
| Lead-Free Status | — | Lead Free |
| Logic Resource Count | — | [DATA_NEEDED: logic cell count] |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slice Count | — | [DATA_NEEDED: DSP slice count] |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |