XC6SLX45-3CSG324I vs XC6SLX25-3CSG324I Comparison

Detailed side-by-side comparison of XC6SLX45-3CSG324I by AMD and XC6SLX25-3CSG324I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-3CSG324I XC6SLX25-3CSG324I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX FPGA Spartan-6 LX FPGA
Logic Cells 43,661 —
Number of I/O 218 —
Process Technology 45 nm —
Core Supply Voltage 1.2 V —
Speed Grade -3 -3
Temperature Grade Industrial, -40°C to +100°C —
Package 324-LFBGA CSPBGA —
Package Designator CSG324 —
Mounting Type Surface mount Surface Mount
Programmable Logic Type FPGA —
FPGA Family Spartan-6 LX Spartan-6 LX
Lead-Free Status Lead Free —
RoHS Status RoHS Compliant [DATA_NEEDED: RoHS compliance status]
Reachable Component Status Active —
Number of Dedicated I/O Banks [DATA_NEEDED: number of dedicated I/O banks] —
Block RAM [DATA_NEEDED: block RAM resources] —
DSP Slices [DATA_NEEDED: DSP slice count] —
Maximum Clock Frequency [DATA_NEEDED: maximum clock frequency] —
Configuration Memory [DATA_NEEDED: configuration memory] —
Programmable Logic Cells — 24,051 cells
Internal Frequency — 500 MHz
Package Type — 324-LFBGA, CSPBGA
Package Dimensions — 15 x 15 mm
Package Pitch — 0.80 mm
Package Designation — MO-275
Number of Pins — 324 pins
Operating Temperature — 0 C to 85 C
Lead-Free Package — Lead-free
Manufacturer — AMD/Xilinx
Catalog Number — XC6SLX25-3CSG324I
REACH Status — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

Datasheets & Resources

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