XC6SLX45-3FGG484I vs XC6SLX45-3FG484I Comparison

Detailed side-by-side comparison of XC6SLX45-3FGG484I by AMD and XC6SLX45-3FG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX45-3FG484I XC6SLX45-3FG484I - 316 I/O Spartan-6 LX FPGA | AMD

XC6SLX45-3FG484I - 316 I/O Spartan-6 LX FPGA | AMD

XC6SLX45-3FG484I ✓ Active

Specification Comparison

Parameter XC6SLX45-3FGG484I XC6SLX45-3FG484I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Active
Device Type Field Programmable Gate Array (FPGA) Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 43,661 cells —
Adaptive Logic Modules 6,822 ALMs —
Configurable Logic Blocks 3,411 CLBs —
Internal Frequency 500 MHz 500 MHz
Maximum Operating Frequency 862 MHz —
Input and Output Count 316 I/O —
Package Type 484-BBGA 484-BBGA
Package Body Size 15 mm x 15 mm —
Ball Pitch 0.80 mm 0.80 mm
Process Technology 45 nm CMOS —
Speed Grade -3 -3
Temperature Grade I (industrial) Industrial
Operating Temperature 0°C to 85°C 0 C to 85 C
Lead-Free Status Lead-free package Lead Free
Board Construction Reference MO-275 —
Mounting Type Surface mount Surface Mount
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] [DATA_NEEDED: AEC-Q100 qualification status]
Number of I/O — 316 I/O
Package Dimensions — 15 x 15 mm
Package Ball Count — 324 balls
Package Outline — MO-275
Logic Resource Count — [DATA_NEEDED: logic cell count]
Block RAM Capacity — [DATA_NEEDED: block RAM capacity]
DSP Slice Count — [DATA_NEEDED: DSP slice count]
Supply Voltage Range — [DATA_NEEDED: supply voltage range]
RoHS Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]

Datasheets & Resources

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