XC6SLX45-3FGG676C vs XC6SLX45-2FG676I Comparison
Detailed side-by-side comparison of XC6SLX45-3FGG676C by Xilinx and XC6SLX45-2FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX45-3FGG676C | XC6SLX45-2FG676I |
|---|---|---|
| Brand | Xilinx | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Spartan-6 LX Field Programmable Gate Array | Spartan-6 LX Field Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 cells | 43,661 cells |
| Process Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Internal Frequency | 500 MHz | — |
| Package | 676-ball BGA | 676-BGA |
| Package Outline | MO-275 | — |
| Package Dimensions | 15 mm x 15 mm | — |
| Package Pitch | 0.80 mm | — |
| Surface Mounting | Surface Mount | — |
| Operating Temperature | 0°C to 85°C | — |
| Speed Grade | -3 | -2 |
| Logic Block Count | [DATA_NEEDED: logic block count] | — |
| Block RAM Capacity | [DATA_NEEDED: block RAM capacity] | — |
| Distributed RAM Capacity | [DATA_NEEDED: distributed RAM capacity] | — |
| Digital Transceivers | [DATA_NEEDED: digital transceiver count] | — |
| Maximum I/O | [DATA_NEEDED: maximum I/O count] | — |
| Lead-Free Status | Lead Free | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | [DATA_NEEDED: AEC-Q100 qualification] |
| Pin/Ball Assignment | [DATA_NEEDED: complete pin and ball assignment] | — |
| I/O Count | — | 358 I/O |
| Technology | — | 45 nm CMOS |
| Temperature Grade | — | Industrial |
| Package Type | — | BGA |
| Number of Terminals | — | 676 |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Programmable Logic Type | — | FPGA |
| Manufacturer | — | AMD / Xilinx |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| Maximum Clock Frequency | — | [DATA_NEEDED: maximum clock frequency] |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Resources | — | [DATA_NEEDED: DSP resource count] |