XC6SLX45-3FGG676C vs XC6SLX45-3FGG676I Comparison

Detailed side-by-side comparison of XC6SLX45-3FGG676C by Xilinx and XC6SLX45-3FGG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-3FGG676C XC6SLX45-3FGG676I
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field Programmable Gate Array Spartan-6 LX Field Programmable Gate Array (FPGA)
Logic Cells 43,661 cells 43,661 cells
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V 1.2 V
Internal Frequency 500 MHz 500 MHz
Package 676-ball BGA —
Package Outline MO-275 —
Package Dimensions 15 mm x 15 mm —
Package Pitch 0.80 mm —
Surface Mounting Surface Mount —
Operating Temperature 0°C to 85°C 0°C to +85°C
Speed Grade -3 —
Logic Block Count [DATA_NEEDED: logic block count] —
Block RAM Capacity [DATA_NEEDED: block RAM capacity] —
Distributed RAM Capacity [DATA_NEEDED: distributed RAM capacity] —
Digital Transceivers [DATA_NEEDED: digital transceiver count] —
Maximum I/O [DATA_NEEDED: maximum I/O count] —
Lead-Free Status Lead Free Lead Free
RoHS Status [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Pin/Ball Assignment [DATA_NEEDED: complete pin and ball assignment] —
Performance Grade — -3 speed grade
Maximum Clock Frequency — 667 MHz
Configuration Logic Cells — 3,411 CLBs
Package Type — 676-ball BGA
Package Code — FGG676
Package Family — FBGA-676
Number of Terminals — 676 balls
Mounting Type — Surface Mount
Temperature Grade — Industrial
Device Family — Spartan-6 LX
Programmable Logic Type — CMOS FPGA

Datasheets & Resources

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