XC6SLX45-3FGG676I vs XC6SLX45-3FGG676C Comparison

Detailed side-by-side comparison of XC6SLX45-3FGG676I by AMD and XC6SLX45-3FGG676C by Xilinx. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX45-3FGG676I XC6SLX45-3FGG676C
Brand AMD Xilinx
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field Programmable Gate Array (FPGA) Spartan-6 LX Field Programmable Gate Array
Logic Cells 43,661 cells 43,661 cells
Process Technology 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1.2 V 1.2 V
Performance Grade -3 speed grade —
Internal Frequency 500 MHz 500 MHz
Maximum Clock Frequency 667 MHz —
Configuration Logic Cells 3,411 CLBs —
Package Type 676-ball BGA —
Package Code FGG676 —
Package Family FBGA-676 —
Number of Terminals 676 balls —
Mounting Type Surface Mount —
Operating Temperature 0°C to +85°C 0°C to 85°C
Temperature Grade Industrial —
Lead-Free Status Lead Free Lead Free
Device Family Spartan-6 LX —
Programmable Logic Type CMOS FPGA —
Package — 676-ball BGA
Package Outline — MO-275
Package Dimensions — 15 mm x 15 mm
Package Pitch — 0.80 mm
Surface Mounting — Surface Mount
Speed Grade — -3
Logic Block Count — [DATA_NEEDED: logic block count]
Block RAM Capacity — [DATA_NEEDED: block RAM capacity]
Distributed RAM Capacity — [DATA_NEEDED: distributed RAM capacity]
Digital Transceivers — [DATA_NEEDED: digital transceiver count]
Maximum I/O — [DATA_NEEDED: maximum I/O count]
RoHS Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]
Pin/Ball Assignment — [DATA_NEEDED: complete pin and ball assignment]

Datasheets & Resources

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