XC6SLX45T-2FG484C vs XC6SLX45T-3FG484I Comparison
Detailed side-by-side comparison of XC6SLX45T-2FG484C by AMD and XC6SLX45T-3FG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX45T-2FG484C | XC6SLX45T-3FG484I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | Spartan-6 LXT Field-Programmable Gate Array | Spartan-6 LXT Field-Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 cells | 43,661 cells |
| Configurable Logic Blocks | 3,411 CLBs | — |
| User I/O Count | 296 I/Os | — |
| Core Supply Voltage | 1.2 V | — |
| Manufacturing Technology | 45 nm CMOS | — |
| Package | 484-pin FBGA | 484-pin FBGA |
| Performance Grade | -2 speed grade | — |
| Temperature-Grade Code | C commercial grade | — |
| Programmable Logic Technology | 45 nm FPGA technology | — |
| FPGA Family | Spartan-6 LXT | Spartan-6 LXT |
| Device Category | Field-programmable gate array | — |
| Package Ball Count | 484 balls | — |
| Mounting Type | Surface mount | Surface Mount |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Package Dimensions | [DATA_NEEDED: package dimensions] | 15 mm x 15 mm |
| Package Pitch | [DATA_NEEDED: package ball pitch] | 0.80 mm |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Slices | [DATA_NEEDED: DSP slice count] | — |
| RoHS Status | unknown | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | unknown | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | not_applicable | [DATA_NEEDED: AEC-Q100 qualification status] |
| Process Technology | — | 45 nm CMOS |
| Supply Voltage | — | 1.2 V |
| Package Type | — | 484-BBGA |
| Pin Count | — | 484 balls |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Speed Grade | — | -3 |
| Temperature Grade | — | Industrial |
| Programmability | — | Field-programmable digital logic |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |