XC6SLX75-2FG676I vs XC6SLX75-3FG676I Comparison

Detailed side-by-side comparison of XC6SLX75-2FG676I by AMD and XC6SLX75-3FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX75-2FG676I XC6SLX75-3FG676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Unknown Unknown
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $0.00
Device Type FPGA Field Programmable Gate Array (FPGA)
FPGA Family Spartan-6 LX Spartan-6 LX
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Stated Internal Frequency 667 MHz —
Maximum Inputs or Outputs 400 I/O —
Package 676-BGA 676-ball FCBGA
Reported Package Dimensions 23 mm x 23 mm —
Reported Package Pitch 1 mm —
Temperature Designation I (industrial) —
Operating Temperature 0 C to 85 C; conflicting source also reports -40 C to 100 C —
Technology 45 nm CMOS —
Core Supply Voltage 1.2 V —
Programmable Architecture Field-configurable digital logic —
Mounting Type Surface mount —
Manufacturer AMD / Xilinx —
RoHS Status unknown [DATA_NEEDED: RoHS status]
REACH Status unknown [DATA_NEEDED: REACH status]
AEC-Q100 Status unknown —
Maximum Frequency — 862 MHz
I/O Count — 408 I/O
Process Technology — 45 nm CMOS
Package Body Size — 27 mm x 27 mm
Ball Pitch — 1 mm
Terminal Count — 676 terminals
Temperature Grade — Industrial
Speed Grade — -3
Surface-Mount Type — Ball Grid Array (BGA)
Verified Distributor Price — USD 67.1347 per unit
LCSC Availability — In stock
Lead-Free Status — [DATA_NEEDED: lead-free status]
Automotive Qualification — [DATA_NEEDED: AEC-Q100 qualification]

Datasheets & Resources

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