XC6SLX75-2FGG484C vs XC6SLX75-2FGG484I Comparison

Detailed side-by-side comparison of XC6SLX75-2FGG484C by AMD and XC6SLX75-2FGG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX75-2FGG484C XC6SLX75-2FGG484C - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG484C - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG484C ✓ Active

Specification Comparison

Parameter XC6SLX75-2FGG484C XC6SLX75-2FGG484I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type FPGA —
FPGA Family Spartan-6 LX —
Logic Cells 74,637 cells 74,637
Configurable Logic Blocks 5,831 CLBs —
I/O Count 280 I/O —
Internal Frequency 667 MHz —
Process Technology 45 nm CMOS 45 nm CMOS
Package Type FBGA-484 —
Package Dimensions 23 mm x 23 mm —
Package Pitch 1 mm —
Pin Count 484 pins —
Operating Temperature 0 °C to 85 °C —
Speed Grade -2 -2 (mid-range)
Temperature Grade Code C —
Mounting Type Surface Mount Surface Mount (BGA)
Programmable Logic Technology 45 nm CMOS —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Device Family — Spartan-6 LX
Logic Elements / Slices — 11,650 slices
System Gates — 3,170,304
Block RAM — 4,824 Kbits (180 x 18 Kbit)
DSP Slices (DSP48A1) — 132
User I/Os — 280
Maximum Internal Frequency — 667 MHz
Core Supply Voltage (VCCINT) — 1.14 V to 1.26 V
Auxiliary Supply Voltage (VCCAUX) — 3.3 V
Package — 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch
Operating Temperature (Industrial) — -40 °C to +100 °C (junction to +125 °C)
MSL Level — 3 (168 hours)

Datasheets & Resources

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