XC6SLX75-2FGG484C vs XC6SLX75-3FGG484C Comparison
Detailed side-by-side comparison of XC6SLX75-2FGG484C by AMD and XC6SLX75-3FGG484C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX75-2FGG484C | XC6SLX75-3FGG484C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | FPGA | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 74,637 cells | 74,637 |
| Configurable Logic Blocks | 5,831 CLBs | — |
| I/O Count | 280 I/O | — |
| Internal Frequency | 667 MHz | — |
| Process Technology | 45 nm CMOS | — |
| Package Type | FBGA-484 | 484-ball FBGA (MS-034) |
| Package Dimensions | 23 mm x 23 mm | — |
| Package Pitch | 1 mm | 1.0 mm |
| Pin Count | 484 pins | — |
| Operating Temperature | 0 °C to 85 °C | — |
| Speed Grade | -2 | -3 (highest performance in Spartan-6 LX family) |
| Temperature Grade Code | C | — |
| Mounting Type | Surface Mount | Surface Mount (SMD) |
| Programmable Logic Technology | 45 nm CMOS | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | unknown |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Spartan-6 LX |
| User I/O Count | — | 280 |
| Package Body Size | — | 23 x 23 mm |
| Internal Clock Frequency | — | 667 MHz |
| Operating Temperature Range | — | 0 °C to 85 °C (commercial grade) |
| Supply Voltage | — | [DATA_NEEDED: supply voltage range] |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slices | — | [DATA_NEEDED: DSP48A slice count] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards per bank] |
| Manufacturer | — | AMD (formerly Xilinx) |
| Order Code Suffix | — | C = commercial temperature grade |