XC6SLX75-2FGG484C vs XC6SLX75-N3FG484I Comparison
Detailed side-by-side comparison of XC6SLX75-2FGG484C by AMD and XC6SLX75-N3FG484I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX75-2FGG484C | XC6SLX75-N3FG484I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | FPGA | Spartan-6 LX field-programmable gate array |
| FPGA Family | Spartan-6 LX | — |
| Logic Cells | 74,637 cells | 5,831 |
| Configurable Logic Blocks | 5,831 CLBs | — |
| I/O Count | 280 I/O | — |
| Internal Frequency | 667 MHz | — |
| Process Technology | 45 nm CMOS | 45 nm |
| Package Type | FBGA-484 | — |
| Package Dimensions | 23 mm x 23 mm | — |
| Package Pitch | 1 mm | — |
| Pin Count | 484 pins | — |
| Operating Temperature | 0 °C to 85 °C | — |
| Speed Grade | -2 | N3 |
| Temperature Grade Code | C | — |
| Mounting Type | Surface Mount | Surface mount |
| Programmable Logic Technology | 45 nm CMOS | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Logic Elements | — | 74,637 |
| Total RAM | — | 3,170,304 bits |
| User I/O | — | 280 |
| Package | — | 484-FBGA, 23 mm x 23 mm |
| Supply Voltage | — | 1.14 V to 1.26 V |
| Junction Temperature Range | — | -40 °C to 100 °C |
| Temperature Grade | — | Industrial |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| DSP Slices | — | [DATA_NEEDED: DSP48A1 slice count] |
| Block RAM Count | — | [DATA_NEEDED: block RAM count] |
| Maximum Clock Frequency | — | [DATA_NEEDED: maximum clock frequency] |