XC6SLX75-3FGG676I vs XC6SLX75-2FG676I Comparison

Detailed side-by-side comparison of XC6SLX75-3FGG676I by AMD and XC6SLX75-2FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX75-3FGG676I XC6SLX75-2FG676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Device Type Spartan-6 LX Field-Programmable Gate Array (FPGA) FPGA
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Internal Frequency 667 MHz —
I/O Count 408 I/O —
Package 676-ball FBGA, 27 mm x 27 mm, 1.0 mm pitch 676-BGA
Mounting Type Surface Mount Surface mount
Speed Grade -3 performance grade —
Industrial Temperature Range -40°C to +100°C —
Process Technology 45 nm CMOS —
Block RAM [DATA_NEEDED: block RAM capacity] —
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Supply Voltage [DATA_NEEDED: core and I/O supply voltages] —
Input/Output Standards [DATA_NEEDED: supported I/O standards] —
Configuration Interface [DATA_NEEDED: configuration interfaces] —
RoHS Status Compliant unknown
Lead-Free Status Lead Free —
FPGA Family — Spartan-6 LX
Stated Internal Frequency — 667 MHz
Maximum Inputs or Outputs — 400 I/O
Reported Package Dimensions — 23 mm x 23 mm
Reported Package Pitch — 1 mm
Temperature Designation — I (industrial)
Operating Temperature — 0 C to 85 C; conflicting source also reports -40 C to 100 C
Technology — 45 nm CMOS
Core Supply Voltage — 1.2 V
Programmable Architecture — Field-configurable digital logic
Manufacturer — AMD / Xilinx
REACH Status — unknown
AEC-Q100 Status — unknown

Datasheets & Resources

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