XC6SLX75-3FGG676I vs XC6SLX75-2FGG676I Comparison

Detailed side-by-side comparison of XC6SLX75-3FGG676I by AMD and XC6SLX75-2FGG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

AMD
XC6SLX75-2FGG676I XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

XC6SLX75-2FGG676I ✓ Active

Specification Comparison

Parameter XC6SLX75-3FGG676I XC6SLX75-2FGG676I
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field-Programmable Gate Array (FPGA) Spartan-6 LX field-programmable gate array (FPGA)
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Internal Frequency 667 MHz 667 MHz
I/O Count 408 I/O —
Package 676-ball FBGA, 27 mm x 27 mm, 1.0 mm pitch —
Mounting Type Surface Mount Surface mount
Speed Grade -3 performance grade -2
Industrial Temperature Range -40°C to +100°C —
Process Technology 45 nm CMOS 45 nm CMOS
Block RAM [DATA_NEEDED: block RAM capacity] [DATA_NEEDED: block RAM capacity]
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Supply Voltage [DATA_NEEDED: core and I/O supply voltages] 1 V
Input/Output Standards [DATA_NEEDED: supported I/O standards] —
Configuration Interface [DATA_NEEDED: configuration interfaces] —
RoHS Status Compliant —
Lead-Free Status Lead Free Lead free
Input/Output Count — 408 I/O
Package Type — 676-ball FBGA
Package Dimensions — 27 mm × 27 mm
Ball Pitch — 1 mm
Operating Temperature — -40°C to +100°C
Device Family — Spartan-6 LX
FPGA Configuration — [DATA_NEEDED: FPGA configuration interface and supported configuration modes]
DSP Resources — [DATA_NEEDED: DSP slice count]
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
REACH Compliance — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

Datasheets & Resources

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