XC6SLX75-3FGG676I vs XC6SLX75-3FGG676C Comparison

Detailed side-by-side comparison of XC6SLX75-3FGG676I by AMD and XC6SLX75-3FGG676C by Xilinx. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC6SLX75-3FGG676I XC6SLX75-3FGG676C
Brand AMD Xilinx
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Spartan-6 LX Field-Programmable Gate Array (FPGA) FPGA (Field Programmable Gate Array)
Logic Cells 74,637 cells 74,637
Configurable Logic Blocks 5,831 CLBs —
Internal Frequency 667 MHz 400 MHz (device summary listing; 667 MHz and 862 MHz cited in other listings - verify against the authoritative Fmax table)
I/O Count 408 I/O —
Package 676-ball FBGA, 27 mm x 27 mm, 1.0 mm pitch —
Mounting Type Surface Mount Surface Mount
Speed Grade -3 performance grade -3 (highest performance grade)
Industrial Temperature Range -40°C to +100°C —
Process Technology 45 nm CMOS 45 nm CMOS
Block RAM [DATA_NEEDED: block RAM capacity] 3,096 Kbit
DSP Slice Count [DATA_NEEDED: DSP slice count] —
Supply Voltage [DATA_NEEDED: core and I/O supply voltages] 1.14 V to 1.26 V
Input/Output Standards [DATA_NEEDED: supported I/O standards] —
Configuration Interface [DATA_NEEDED: configuration interfaces] —
RoHS Status Compliant —
Lead-Free Status Lead Free —
FPGA Family — Spartan-6 LX
Configurable Logic Blocks (CLBs) — 5,831
User I/O — 408
DSP48A1 Slices — 132
Operating Temperature — 0 C to 85 C (commercial)
Package Type — FBGA-676 (PBGA676)
Package Dimensions — 27 mm x 27 mm, 1.0 mm ball pitch
Clock Management — DCM and PLL present
Lead-Free — Yes
RoHS — [DATA_NEEDED: RoHS compliance statement for this exact orderable]
REACH — [DATA_NEEDED: REACH declaration for this exact orderable]
Automotive Grade (AEC-Q100) — Not qualified - commercial temperature grade
Maximum Package Pin Count — 676 balls

Datasheets & Resources

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