XC6SLX75-L1FG676I vs XC6SLX75-2FG676I Comparison
Detailed side-by-side comparison of XC6SLX75-L1FG676I by AMD and XC6SLX75-2FG676I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC6SLX75-L1FG676I | XC6SLX75-2FG676I |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Unknown |
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) | FPGA |
| Logic Cells | 74,637 cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs | 5,831 CLBs |
| User I/O | 408 I/O | — |
| Process Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1 V | 1.2 V |
| Package | 676-ball FBGA | 676-BGA |
| Package Body Size | 27 x 27 mm | — |
| Ball Pitch | 1 mm | — |
| Terminal Count | 676 terminals | — |
| Package Shape | Square | — |
| Mounting Style | BGA | — |
| Temperature Grade | Industrial | — |
| Lead-Free Status | Lead-free | — |
| Programmability | User-programmable FPGA logic | — |
| FPGA Family | — | Spartan-6 LX |
| Stated Internal Frequency | — | 667 MHz |
| Maximum Inputs or Outputs | — | 400 I/O |
| Reported Package Dimensions | — | 23 mm x 23 mm |
| Reported Package Pitch | — | 1 mm |
| Temperature Designation | — | I (industrial) |
| Operating Temperature | — | 0 C to 85 C; conflicting source also reports -40 C to 100 C |
| Technology | — | 45 nm CMOS |
| Programmable Architecture | — | Field-configurable digital logic |
| Mounting Type | — | Surface mount |
| Manufacturer | — | AMD / Xilinx |
| RoHS Status | — | unknown |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |